questions? contact us: marketing@amkor.com visit amkor technology online for locations and to view the most current product information. thermal performance forced convection, single-layer pcb pkg die size (mm) s/ns ja (c/w) by velocity (lfpm) 0 200 500 20 ld 5.1 x 5.1 s 50.8 35.7 27.8 ns 52.4 37.6 28.8 forced convection, multi-layer pcb pkg die size (mm) s/ns ja (c/w) by velocity (lfpm) 0 200 500 20 ld 5.1 x 5.1 s 19.2 14.2 12.2 ns 25.7 20.4 17.8 s = slug soldered to test board ns = slug not soldered to test board jedec standard test boards electrical performance pkg body size (mm) pad size (mm) lead inductance (nh) capacitance (pf) resistance (mf) 20 ld 11 x 15.9 7.5 x 7.9 longest shortest 3.130 1.540 1.990 0.604 30.6 9.42 simulated results @ 100 mhz reliability qualification amkor package qualification uses three independent production lots and a minimum of 77 units per test group. all testing includes jstd-020 moisture preconditioning. ? moisture sensitivity jedec level 3, 30c/60% rh, 192 hrs characterization ? uhast 130c/85% rh, no bias, 96 hrs ? temp cycle -65c/+150c, 500 cycles ? high temp storage 150c, 1000 hours process highlights ? pcc wire bonding standard, ag wire available ? wafer backgrinding services available ? multiple die and die stacking capability ? nipdau (ppf) or matte sn lead finish options ? laser mark on package body ds320k rev date: 3/15 POWERSOP ? 3 power small outline package, POWERSOP ? (psop3) psop3 is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in ic packaging. this industry standard package utilizes a thick copper heat slug to accommodate the needs of higher power devices. a green bom is standard, allowing devices to meet applicable pb-free and rohs standards. features ? cu wire interconnect for low cost ? standard jedec package outlines ? multi-die production capability ? turnkey test services ? green materials are standard C pb-free and rohs compliant ? theta jc of under 1c/w can be achieved with optimal heatsinking ? highly conductive copper heat-slug and leadframes ? psop3 package has optional soft solder die attach for enhanced power capability new developments ? stealth dicing (narrow saw streets) ? leadframe roughening for improved msl capability services and support amkor has a broad base of resources available to help customers bring quality new products to market quickly and at the lowest possible cost. ? full package characterization ? thermal, mechanical stress and electrical performance modeling ? turnkey assembly, test and drop ship ? world class reliability testing and failure analysis leadframe data sheet
questions? contact us: marketing@amkor.com visit amkor technology online for locations and to view the most current product information. ds320k rev date: 3/15 cross-section POWERSOP ? 3 (bottom slug) configuration options POWERSOP (psop3) nominal package dimensions (mm) lead count body width body length body thickness standoff overall height lead pitch tip-to-tip jedec 20 11.0 mm (.433) 15.9 3.15 0.20 3.35 1.27 14.2 mo-166 24 11.0 mm (.433) 15.9 3.15 0.20 3.35 1.00 14.2 mo-166 30 11.0 mm (.433) 15.9 3.15 0.20 3.35 0.80 14.2 mo-166 36 11.0 mm (.433) 15.9 3.15 0.20 3.35 0.65 14.2 mo-166 44 11.0 mm (.433) 15.9 3.15 0.20 3.35 0.65 14.2 mo-166 test services ? program generation/conversion ? wafer probe ? burn-in capabilities ? -55c to +165c test available shipping ? clear anti-static tube, 20 inch ? tape and reel ? dry pack ? drop ship POWERSOP ? 3 cross-section POWERSOP ? 3 (top slug) leadframe data sheet with respect to the information in this document, amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. this document does not in any way extend or modify amkors warranty on any product beyond that set forth in its standard terms and conditions of sale. amkor reserves the right to make changes in its product and specifications at any time and without notice. the amkor name and logo are registered trademarks of amkor technology, inc. all other trademarks mentioned are property of their respective companies. ? 2015, amkor technology incorporated. all rights reserved.
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